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1

Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing

Qin, Hongbo, Liu, Tianhan, Li, Wangyun, Yue, Wu, Yang, Daoguo

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 9.56 MB

2020

2

A Novel Interconnected Structure of Graphene-Carbon Nanotubes for the Application of Methane Adsorption

Yang, Ning, Yang, Daoguo, Chen, Liangbiao, Liu, Dongjing, Cai, Miao, Fan, Xuejun

Journal:

IEEE Sensors Journal

Year:

2018

Language:

english

File:

PDF, 1.70 MB

english, 2018

3

Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound

Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, Guoqi

Journal:

Year:

2019

Language:

english

File:

PDF, 15.62 MB

english, 2019

4

Mechanical, Thermodynamic and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

Qin, Hongbo, Luan, Xinghe, Feng, Chuang, Yang, Daoguo, Zhang, Guoqi

Journal:

Year:

2017

Language:

english

File:

PDF, 8.73 MB

english, 2017

5

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Advanced reliability study on high temperature automotive electronics

Daoguo Yang,, Dongjing Liu,, van Driel, W.D., Scholten, Huib, Goumans, L., Faria, R.

Year:

2010

Language:

english

File:

PDF, 844 KB

english, 2010

6

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Thermal-mechanical stress and fatigue failure analysis of a PBGA

Xiuyun Hao,, Liancheng Qin,, Daoguo Yang,, Shilong Liu,

Year:

2003

Language:

english

File:

PDF, 305 KB

english, 2003

7

First-principles approach to design and evaluation of graphene as methane sensors

Yang, Daoguo, Yang, Ning, Ni, Jiaming, Xiao, Jing, Jiang, Junke, Liang, Qiuhua, Ren, Tianling, Chen, Xianping

Journal:

Materials & Design

Year:

2017

Language:

english

File:

PDF, 1.53 MB

english, 2017

8

Asymmetric Long-Range Surface Plasmon Polariton Waveguides for Sensing Applications

Wei, Qiqin, Xiao, Jing, Chen, Shirong, Wang, Quan, Cai, Miao, Yang, Daoguo, Qin, Hongbo

Journal:

IEEE Photonics Journal

Year:

2019

Language:

english

File:

PDF, 3.18 MB

english, 2019

9

A hybrid prediction method on luminous flux maintenance of high-power LED lamps

Cai, Miao, Yang, Daoguo, Tian, Kunmiao, Chen, Wenbin, Chen, Xianping, Zhang, Ping, Fan, Xuejun, Zhang, Guoqi

Journal:

Applied Thermal Engineering

Year:

2016

Language:

english

File:

PDF, 3.33 MB

english, 2016

10

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A First Principles Study of Blue Phosphorene as A Superior Media for Gas Sensor

Niu, Fanfan, Yang, Daoguo, Cai, Miao, Li, Xiaoling, Liu, Dongjing

Year:

2018

Language:

english

File:

PDF, 1.53 MB

english, 2018

11

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - The effects of temperature and humidity on the optical properties of PMMA: A hybrid first principle calculation and molecular dynamic simulation

Ma, Ding, Yang, Daoguo, Chen, Xuanyou, Zhang, Maofen, Wang, Xiyou, Cai, Miao

Year:

2017

Language:

english

File:

PDF, 765 KB

english, 2017

12

Entropy-based analysis and classification of acute tonic pain from microwave transcranial signals obtained via the microwave-scattering approach

Yang, Daoguo, Geng, Daoshuang, Zheng, Lixia, Cai, Miao, Hao, Weidong

Journal:

Biomedical Signal Processing and Control

Year:

2021

File:

PDF, 4.49 MB

2021

13

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material

Wang, Hu, Yang, Daoguo, Cai, Miao, Wang, Xiyou, Liang, Zhi

Year:

2018

Language:

english

File:

PDF, 3.26 MB

english, 2018

14

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - An online-sintering approach for bonding high-power devices using nanosilver paste

Yan, Haidong, Ma, Weiyong, Mei, Yunhui, Yang, Daoguo

Year:

2018

Language:

english

File:

PDF, 7.66 MB

english, 2018

15

Design and Analysis of a Novel Phase-Shifted Bragg Grating for Bloch Surface Waves

Wei, Qiqin, Xiao, Jing, Chen, Shirong, Wang, Quan, Sun, Peng, Cai, Miao, Yang, Daoguo

Journal:

IEEE Photonics Journal

Year:

2018

Language:

english

File:

PDF, 1.82 MB

english, 2018

16

First Principles Study of Gas Molecules Adsorption on Monolayered β-SnSe

Liu, Tianhan, Qin, Hongbo, Yang, Daoguo, Zhang, Guoqi

Journal:

Year:

2019

Language:

english

File:

PDF, 30.93 MB

english, 2019

17

Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method

Cai, Miao, Yang, Daoguo, Tian, Kunmiao, Zhang, Ping, Chen, Xianping, Liu, Lilin, Zhang, Guoqi

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.09 MB

english, 2015

18

Effects of thermal reflowing stress on mechanical properties of novel SMT-SREKs

Cai, Miao, Liang, Yonghu, Yun, Minghui, Chen, Xuanyou, Yan, Haidong, Yu, Zhaozhe, Yang, Daoguo, Zhang, Guoqi

Journal:

Year:

2019

Language:

english

File:

PDF, 6 KB

english, 2019

19

Experimental Characterization Methods for Thermal Contact Resistance: A Review

Xian, Yaoqi, Zhai, Siping, Yuan, Peng, Zhang, Ping, Yang, Daoguo

Journal:

Applied Thermal Engineering

Year:

2017

Language:

english

File:

PDF, 2.61 MB

english, 2017

20

Silver nanopaste: Synthesis, reinforcements and application

Zhang, Ping, Jiang, Xiong, Yuan, Peng, Yan, Haidong, Yang, Daoguo

Journal:

International Journal of Heat and Mass Transfer

Year:

2018

Language:

english

File:

PDF, 5.43 MB

english, 2018

21

Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging

Zhang, Ping, Wei, Rongzhuan, Zeng, Jianhua, Cai, Miao, Xiao, Jing, Yang, Daoguo

Journal:

Journal of Nanomaterials

Year:

2016

Language:

english

File:

PDF, 8.62 MB

english, 2016

22

Parametric matching selection approach for Satellite Gear Mechanism

Ping, Yang, Zhihua, Li, Daoguo, Yang

Journal:

International Journal of Product Development

Year:

2008

Language:

english

File:

PDF, 212 KB

english, 2008

23

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - A multivariate system reliability estimation method based on step stress accelerated degradation testing

Jia, Hongliang, Cai, Miao, Yang, Daoguo

Year:

2013

Language:

english

File:

PDF, 342 KB

english, 2013

24

Reliability modeling on a MOSFET power package based on embedded die technology

Daoguo Yang, Martien Kengen, W.G.M. Peels, David Heyes, W.D. van Driel

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.17 MB

english, 2010

25

Thermal analysis of LED lighting system with different fin heat sinks

Hou, Fengze, Yang, Daoguo, Zhang, Guoqi

Journal:

Journal of Semiconductors

Year:

2011

Language:

english

File:

PDF, 783 KB

english, 2011

26

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Zhang, Ping, Zeng, Jianhua, Zhai, Siping, Xian, Yaoqi, Yang, Daoguo, Li, Qiang

Journal:

Macromolecular Materials and Engineering

Year:

2017

Language:

english

File:

PDF, 2.48 MB

english, 2017

27

Evaluation survey of microbial disinfection methods in UV-LED water treatment systems

Li, Xiaoling, Cai, Miao, Wang, Lei, Niu, Fanfan, Yang, Daoguo, Zhang, Guoqi

Journal:

Science of The Total Environment

Year:

2019

Language:

english

File:

PDF, 1.10 MB

english, 2019

28

Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

Cai, Miao, Yang, Daoguo, Huang, Jianlin, Zhang, Maofen, Chen, Xianping, Liang, Caihang, Koh, Sau, Zhang, Guoqi

Journal:

IEEE Photonics Journal

Year:

2017

Language:

english

File:

PDF, 1.27 MB

english, 2017

29

The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene

Yang, Ning, Yang, Daoguo, Zhang, Guoqi, Chen, Liangbiao, Liu, Dongjing, Cai, Miao, Fan, Xuejun

Journal:

Year:

2018

Language:

english

File:

PDF, 2.24 MB

english, 2018

30

Degradation Mechanisms of Mid-Power White-Light LEDs Under High-Temperature–Humidity Conditions

Huang, Jianlin, Golubovic, Dusan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, X. J., Zhang, G. Q.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 1.47 MB

english, 2015

31

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Two-step thermoelectric modeling for junction temperature prediction of LED lamps

Tian, Kunmiao, Cai, Miao, Zhang, Ping, Chen, Xianping, Yang, Daoguo

Year:

2014

Language:

english

File:

PDF, 606 KB

english, 2014

32

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal transient analysis of LED array system with in-line pin fin heat sink

Fengze Hou,, Daoguo Yang,, Zhang, G.Q., Yang Hai,, Dongjing Liu,, Lei Liu,

Year:

2011

Language:

english

File:

PDF, 1.29 MB

english, 2011

33

Sliding simulation for adhesion problems in micro gear trains based on an atomistic simplified model

Yang Ping, Liao Ning Bo, Yang Daoguo, L. J. Ernst

Journal:

Microsystem Technologies

Year:

2006

Language:

english

File:

PDF, 363 KB

english, 2006

34

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Optimization design for packaging device QFN using a prediction model of the neural-genetic algorithm

Cai, Miao, Yang, Daoguo, Niu, Ligang, Zhao, Mingjun, Chen, Wenbin

Year:

2009

Language:

english

File:

PDF, 927 KB

english, 2009

35

[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Fast life-time assessment of LED luminaries

Daoguo Yang,, Miao Cai,, Wenbin Chen,, Zhen Zhang,

Year:

2012

Language:

english

File:

PDF, 288 KB

english, 2012

36

A novel technique for micro-hole forming on skull with the assistance of ultrasonic vibration

Li, Zhe, Yang, Daoguo, Hao, Weidong, Wu, Tiecheng, Wu, Song, Li, Xiaoping

Journal:

Journal of the Mechanical Behavior of Biomedical Materials

Year:

2016

Language:

english

File:

PDF, 5.03 MB

english, 2016

37

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - De-embedding transmission line of SiO2 thin-film measurements for accurate characteristics

Chen, Wenbin, Yun, Minghui, Cai, Miao, Wang, Xiaolei, Qin, Zhen, Yang, Daoguo

Year:

2015

Language:

english

File:

PDF, 1.05 MB

english, 2015

38

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Sensitivity study on a MEMS inclinometer with different packaging thickness

Yang, Yu, Yang, Daoguo, Zhang, Zhen, Zhong, Jianzhen

Year:

2013

Language:

english

File:

PDF, 758 KB

english, 2013

39

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal design and analysis of high power LED with LTCC packaging

Hai, Yang, Yang, Daoguo, Yan, Dejin, Tian, Wanchun

Year:

2012

Language:

english

File:

PDF, 818 KB

english, 2012

40

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Die fracture probability prediction and design guidelines for laminate-based over-molded packages

Yang, Daoguo, Bielen, Jeroen, Theunis, F., van Driel, W. D., Zhang, G. Q.

Year:

2008

Language:

english

File:

PDF, 406 KB

english, 2008

41

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Test procedure of indoor lighting LED luminaires based on step-stress accelerated degradation test

Tian, Wanchun, Cai, Miao, Zhang, Weihai, Tian, Kunmiao, Zhang, Ping, Chen, Xianping, Yang, Daoguo

Year:

2015

File:

PDF, 946 KB

2015

42

Thermal degradation kinetics of LED lamps in step-up-stress and step-down-stress accelerated degradation testing

Cai, Miao, Yang, Daoguo, Zheng, Jianna, Mo, Yuezhu, Huang, Jianlin, Xu, Jiwen, Chen, Wenbin, Zhang, Guoqi, Chen, Xianping

Journal:

Applied Thermal Engineering

Year:

2016

Language:

english

File:

PDF, 2.22 MB

english, 2016

43

[IEEE 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Beijing, China (2016.6.5-2016.6.8)] 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Microwave dielectric characterisation of SiO2 thin films through a single MIM test structure

Zhen Qin,, Wenbin Chen,, Xiaolei Wang,, Daoguo Yang,, Miao Cai,, Minghui Yun,

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

44

Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound

Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, Guoqi

Journal:

Year:

2019

File:

PDF, 15.62 MB

2019

45

[IEEE 2018 IEEE 4th Information Technology and Mechatronics Engineering Conference (ITOEC) - Chongqing, China (2018.12.14-2018.12.16)] 2018 IEEE 4th Information Technology and Mechatronics Engineering Conference (ITOEC) - Research on Kinematic Modeling and Analysis Methods of UR Robot

Liu, Qiang, Yang, Daoguo, Hao, Weidong, Wei, Yao

Year:

2018

Language:

english

File:

PDF, 3.80 MB

english, 2018

46

[IEEE 2015 IEEE International Conference on Mechatronics and Automation (ICMA) - Beijing, China (2015.8.2-2015.8.5)] 2015 IEEE International Conference on Mechatronics and Automation (ICMA) - The latest research status and prospect on microwave technology for monitoring concerned brain activity

Wan, Xiang, Yang, Daoguo, Cai, Miao, Han, Shunfeng, Wu, Song, Hao, Weidong

Year:

2015

Language:

english

File:

PDF, 849 KB

english, 2015

47

Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

Qin, Hongbo, Kuang, Tianfeng, Luan, Xinghe, Li, Wangyun, Xiao, Jing, Zhang, Ping, Yang, Daoguo, Zhang, Guoqi

Journal:

Year:

2018

Language:

english

File:

PDF, 6.26 MB

english, 2018

48

Asymmetric Long-Range Surface Plasmon Polariton Waveguides for Sensing Applications

Wei, Qiqin, Xiao, Jing, Chen, Shirong, Wang, Quan, Cai, Miao, Yang, Daoguo, Qin, Hongbo

Journal:

IEEE Photonics Journal

Year:

2019

File:

PDF, 3.18 MB

2019

49

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Hygro-thermo-mechanical modeling of LED Luminaires

Zeng, Pinghua, Yang, Daoguo, Tang, Hongyu, Cai, Miao

Year:

2013

Language:

english

File:

PDF, 1.44 MB

english, 2013

50

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - The application of RSM in optimization of the curing profile for electronic packaging polymers

Fuhong Huang,, Yubing Gong,, Quanyong Li,, Daoguo Yang,

Year:

2005

Language:

english

File:

PDF, 449 KB

english, 2005

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